Replacement wafer tip recommended for handling up to 8" (203 mm) wafers
Material: Molded from ESD safe peek plastic to handle wafers up to 100ºC
The low profile of the wafer tip head provides easy access to wafers in industry standard boats
Specs
• Electrical Specifications: None
• Weight, Shipping: 2 lb
Portable Wire-Bond Strength Tester
High-Precision Microelectronics Tweezers for Every Need!
Squeegee Blades for Microelectronics Printing
Porta-Wand Kit with 4" Wafer Tip
The portable Wire-Bond Strength Tester performs accurate, reliable wire-bond tests in conformance with MIL-STD 883C | 9101-00 displayedPortable Wire-Bond Strength TesterPortable Wire Bond Strength Tester performs accurate, reliable destructive and nondestructive wire bond testing in conformance with MIL-STD 883C; variety of pull gauges available.
Full range of high-precision tweezers includes models for wafers, chips and other sensitive parts. Shown: Swiss-made tapered tweezer with very fine points, 400 | 9302-47 displayedHigh-Precision Microelectronics Tweezers for Every Need!Full range of high-precision tweezers includes models for wafers, chips and other sensitive parts. Shown: Swiss-made tapered tweezer with very fine points, 400 series (magnetic) stainless steel for die attaching or wire bonding in microelectronic assembly.
Polyurethane squeegee blades come in either hardnesses; precision-molded edges are suitable for precision microelectronics printing | 8101-01 displayedSqueegee Blades for Microelectronics PrintingPolyurethane squeegee blades come in either hardnesses and can be cut to correct print lengths; precision-molded edges are suitable for precision microelectronics screen printers.
Portable, self-contained, continuous vacuum system provides reliable wafer handling | 6422-38 displayedPorta-Wand Kit with 4" Wafer TipThis portable, continuous-vacuum system is ideal for handling wafers, disk media or other delicate flat media; ESD-safe, cleanroom-compatible device lifts over 500g.
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